Semiconductor Heavyweights Descend on Taipei for SEMICON Taiwan 2025

Featuring Chip Guru Jim Keller and Industry Pioneer Dr.Chih-Tay Shih

HSINCHU,Aug. 29, 2025/PRNewswire/ --SEMICON Taiwan 2025 is just two weeks away, and this year's forums will welcome an extraordinary lineup of speakers. Silicon Valley"chip legend"Jim Kellerwill take the stage at theCEO Summit, while Dr.Chin-Tay Shih, a pioneering force inTaiwan'ssemiconductor development, is confirmed to jointhe SEMI 20 Under 40 Awards Ceremony and Tech Master Forum. As the industry builds its central role in the AI era, global leaders will gather inTaipeito chart the future of semiconductor innovation.

Industry Legends Gather inTaiwanto Spotlight Innovation and Leadership

Tenstorrent CEOJim Keller, renowned for his groundbreaking chip designs at Intel, Tesla, and AMD, will headline the CEO Summit with a keynote addressing the key technologies shaping the future of computing. A fireside chat focused onTaiwan'sstrategic role in the global semiconductor landscape will follow, featuring co-moderators Dr.Tien Wu, CEO of ASE and Chair of the SEMI International Board Executive Committee, andCliff Hou, Chairman of TSIA, along with panelistsJim KellerandJochen Hanebeck, CEO of Infineon.

Also taking the stage, Dr.Chin-Tay Shih, a pioneering architect ofTaiwan'ssemiconductor rise, will reflect on his journey from ITRI to helping establish UMC, TSMC, and VIS, underscoring howTaiwanbuilt a complete supply chain and laid the foundation for today's AI era. Joining the Tech Masters Forum are Professor Y-W Peter Hong of NSTC, GC Hung, Senior VP of UMC, andEmily Hong, Chair and Chief Strategy Officer of Wiwynn Corporation.

Post-Moore Era: Heterogeneous Integration and Advanced Packaging Take Center Stage

With scaling reaching its limits, heterogeneous integration and advanced packaging have become the new frontier of innovation. SEMICON Taiwan will debut a dedicated Heterogeneous Integration Zone with nearly 60 companies. The zone includes the3DIC Advanced Packaging Pavilion,Semiconductor Packaging Pavilion, andFOPLP Pavilion.

OnSeptember 9, the3DIC Global Summitwill bring together leaders from ASE, Chroma, GPTC, MediaTek and TSMC, to tackle key issues including efficiency, yield, cross-domain collaboration, and standardization. The day will also see the launch of the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA), rallying global industry leaders to drive collective innovation and propel advanced packaging into its next wave of breakthroughs.

Register now for SEMICON Taiwan 2025 to skip the lines. Industry professionals can get a free admission code byAugust 31. For more details visit the official website.

About SEMI

SEMI^®is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management, and other programs. Our SEMICON^®expositions and events, technology communities, standards, and market intelligence help advance our members'business growth and innovations in design, devices, equipment, materials, services, and software, enabling smarter, faster, more secure electronics. Visitwww.semi.org or join SEMI Facebook,SEMI LinkedIn, andSEMI Official Line Account.

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SOURCE SEMI